Marposs’ chromatic confocal non-contact sensor for battery component measurement

Marposs’ chromatic confocal non-contact sensor for battery component measurement

May 16, 2022

Marposs Corp

https://www.marposs.com/

Marposs, a world leader in measurement, inspection, and test technologies, announced the availability of its high-performance STIL MPLS-DM sensor, the newest member of its Chromaline sensors family. This non-contact sensor enables very fast, high-resolution gauging of distance, roughness, thickness, and shape of all materials including transparent and polished mirror surfaces such as glass, plastic, silicon wafers, liquids, and roll-to-roll transparent or non-transparent film as used in EV battery covers.

The new MPLS-DM provides high quality control and working frequencies up to 2kHz in standard mode or up to 6kHz with a reduced range of the sensor.  It is offered in five different models 180 measuring points aligned along a line ranging from 1 to 12 millimeters and minimum measurable thickness capability of 18µm to 300µm, depending upon the model. All units measure 448.9mm x 184mm x 497mm (17.67” x 7.24” x 19.56”).

The MPLS-DM synchronizes measurement using an encoder for dynamic acquisitions via Ethernet, with the availability of SDK and protocol commands for easy integration into any system.  Based on STIL Chromatic Confocal technology, the MPLS sensor is extremely fast and accurate, making it well-suited for in-line control requirements.

The Confocal Principal
Confocal chromatic measuring technology splits white light into different spectra using lenses focused on an object through a multi-lens optical system. The lenses create and send a chromatically aberrated beam to the target. The target reflects the optical beam back to the probe where it transmits the reflected optical beam to a spectrometer. The reflected optical beam is comprised of rays coming from the outside surface of the object being measured and from the internal surfaces that the beam can reach.

The reflected light intensity is at a maximum for the wavelengths focused on the surfaces. Electronic processing can then determine the intralayer thickness values of the target, or the distance from the probe to the outside surface and to the intralayer surfaces of the target.